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| 2SK3290 Silicon N Channel MOS FET High Speed Switching ADE-208-744 C (Z) 4th.Edition. June 1999 Features * Low on-resistance R DS = 0.455 typ. (VGS = 10 V , ID = 250 mA) R DS = 0.9 typ. (VGS = 4 V , ID = 100 mA) * 4 V gate drive device. * Small package (MPAK) Outline MPAK 3 1 D 2 G 1. Source 2. Gate 3. Drain S 2SK3290 Absolute Maximum Ratings (Ta = 25C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Note: Symbol VDSS VGSS ID I D(pulse) I DR Pch Tch Tstg Note 2 Note1 Ratings 30 20 500 2 500 400 150 -55 to +150 Unit V V mA A mA mW C C 1. PW 10 s, duty cycle 1% 2. Value on the alumina ceramic board (12.5x20x0.7mm) Electrical Characteristics (Ta = 25C) Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Zero gate voltege drain current Symbol V(BR)DSS V(BR)GSS I GSS I DSS Min 30 20 -- -- 1.3 -- -- 350 -- -- -- -- -- -- -- Typ -- -- -- -- -- 0.455 0.9 540 5 30 2 240 1700 850 1300 Max -- -- 5 -1 2.3 0.525 1.25 -- -- -- -- -- -- -- -- Unit V V A A V mS pF pF pF ns ns ns ns Test Conditions I D = 100 A, VGS = 0 I G = 100 A, VDS = 0 VGS = 16 V, VDS = 0 VDS = 30 V, VGS = 0 I D = 10A, VDS = 5 V ID = 250 mA,VGS = 10 V Note 3 ID = 100 mA,VGS = 4 V Note 3 ID = 250 mA, VDS = 10 V Note 3 Gate to source cutoff voltage VGS(off) Static drain to source on state RDS(on) resistance Forward transfer admittance Input capacitance Output capacitance RDS(on) |yfs| Ciss Coss VDS = 10 V VGS = 0 f = 1 MHz I D = 250 mA, VGS = 10 V RL = 40 Reverse transfer capacitance Crss Turn-on delay time Rise time Turn-off delay time Fall time Note: 3. Pulse test 4. Marking is BN t d(on) tr t d(off) tf 2 2SK3290 Main Characteristics Power vs. Temperature Derating 800 *Pch (mW) 5 2 1.0 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0.002 Maximum Safe Operation Area 10 s 100 s 1 ms DC 600 I D (A) Channel Dissipation 400 Drain Current Op = (1 10 m sh s er o at ion t) PW Operation in this area is limited by RDS)on) 200 0 50 100 150 Ta ( C) 200 0.001 Ta=25 C 0.0005 0.05 0.1 0.2 0.5 1.0 2 5 10 20 50 Ambient Temperature Drain to Source Voltage VDS (V) *Value on the alumina ceramic boad (12.5x20x0.7mm) Value on the alumina ceramic boad.(12.5x20x0.7mm) 2.0 Typical Outout Characteristics 7V 6V Pulse Test I D (A) Typical Transfer Characteristics 2.0 25C 75C 1.2 Tc = -25C I D (A) 1.6 5V 1.2 1.6 Drain Current 0.8 4V VGS = 3 V 0 2 4 6 Drain to Source Voltage 8 10 VDS (V) Drain Current 0.8 0.4 0.4 V DS = 10 V Pulse Test 0 2 4 6 Gate to Source Voltage 8 10 VGS (V) 3 2SK3290 Drain to Source Saturation Voltage vs. Gate to Source Voltage Static Drain to Source on State Resistance vs. Drain Current 5 2 VGS = 4V 1.0 0.5 10 V 0.2 0.1 Pulse Test 0.5 Drain to Source Saturation Voltage V DS(on) (V) Pulse Test 0.4 0.3 I D = 500mA 0.2 250m A 0.1 100m A 0 6 2 4 Gate to Source Voltage 8 VGS (V) 10 Static Drain to Source on StateResistance R DS(on) ( ) 0.05 0.1 0.2 Drain Current 0.5 I D (A) 1.0 Static Drain to Source on State Resistance R DS(on) ( ) Forward Transfer Admittance |yfs| (S) 2.0 Static Drain to Source on State Resistance vs. Temperature Forward Transfer Admittance vs. Drain Current 5 V DS = 10 V Pulse Test 2 Tc = -25 C 1.0 0.5 25 C 0.2 0.1 0.05 0.1 0.2 0.5 1.0 75 C 1.6 VGS = 4V I D = 500m A 1.2 100m A, 250m A 0.8 10 V 0.4 100m A, 250m A, 500m A Pulse Test 0 40 80 Tc 120 ( C) 160 Case Temperature 0 -40 Drain Current I D (A) 4 2SK3290 Typical Capacitance vs. Drain to Source Voltage VGS = 0 f = 1 MHz Coss Switching Time t (ns) 100 50 Capacitance C (pF) 10000 5000 2000 1000 500 200 100 50 20 Switching Characteristics tf tr 20 10 5 t d(off) t d(on) Ciss 2 1 0 10 20 Crss 30 40 (V) 50 10 0.1 V GS = 4 V, V DD = 10 V PW = 5 s, duty < 1 % 0.2 Drain Current 0.5 I D (A) 1.0 Drain to Source Voltage VDS Reverse Drain Current vs. Source to Drain Voltage 2.0 Reverse Drain Current I DR (A) 1.6 V GS = 0,-5V 10 V 5V 1.2 0.8 0.4 Pulse Test 0 0.4 0.8 1.2 1.6 VSD 2.0 (V) Source to Drain Voltage 5 2SK3290 Switching Time Test Circuit Vin Monitor D.U.T. RL Vin Vin 10 V 50 V DD = 10 V Vout 10% 10% 90% td(on) tr 90% td(off) tf 10% Vout Monitor Waveforms 90% 6 2SK3290 Package Dimensions Unit: mm 0.65 - 0.3 + 0.1 0.4 - 0.05 + 0.10 0.16 - 0.06 + 0.10 2.8 - 0.6 + 0.2 1.9 2.95 - 0.2 + 0.2 0.3 0.65 - 0.3 + 0.1 0.45 0.95 0.45 0.95 1.5 0 ~ 0.1 1.1- 0.1 + 0.2 MPAK Hitachi Code SC-59 EIAJ TO-236Mod. JEDEC 7 2SK3290 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Copyright (c) Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. 8 |
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